CIMdata PLM Industry Summary Online Archive
14 March 2007
Product News
Zuken and Industry Partners Pioneer Design and Supply Chain Methodology for System-in-Package Technology
Zuken has joined a UK government-driven initiative; the ADEPT-SiP project, that has been set up with the objective of developing a rigorous methodology to assist organizations across the globe in the design and manufacture of system-in-package technology.
The product of this right-first-time design and supply chain methodology will be a design kit for embedded components within printed circuit boards, including functionality for simulation and modelling. Zuken's initial role is to establish SiP (system-in-package) design to manufacturing requirements and define the direction for new design solution development. After analyzing the entire design process, Zuken will provide recommendations for development of the software elements required from each industry partner in order to generate the complete design kit. The availability of this package will then enable SiP to be widely adopted within the electronics industry.
"The mass use of cellular phones, laptops, cameras, PDAs and general RF and wireless devices has really driven an increase in demand for SiP technology. We recognize a real requirement for developing design tools and methodologies that will allow this rapid market growth to continue. By working with the UK government and industry partners, we hope to focus on addressing these R&D needs," stated Tony Cadwell, Zuken's Northern Europe Sales Manager involved in this project.
For more information about the ADEPT-SiP project visit http://www.adept-sip.com/
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