CIMdata PLM Industry Summary Online Archive
January 2006
Product News
Flomerics Announces FLO/PCB for Allegro, Offering Bi-directional Interface to Cadence Allegro PCB Editor
Flomerics announced that it has introduced Version 3.0 of its FLO/PCB thermal design software, FLO/PCB for Allegro, which provides a link to Cadence® Allegro® PCB Editor software. Designers can simply call up a menu item on the Cadence software and, with a few mouse clicks, generate a thermal model of their design. They can quickly analyze the design from a thermal standpoint and identify problems at a stage in the design process when they can be quickly and inexpensively corrected.
The FLO/PCB/Allegro interface transfers information about the PCB's geometry and components needed to perform thermal analysis. This includes the number of metallic layers, the type of each layer such as signal or power or ground plane, the coverage of copper on the board, and the location and power dissipation of each component. The interface also allows the user to select the appropriate layer used to derive the physical extents of the package. Placement updates made in FLO/PCB can be passed back to Allegro PCB Editor thus providing bi-directional connectivity allowing for concurrent placement and thermal design.
The Cadence/Flomerics interface is built using the membership in the Cadence Connections Program for collaboration, bringing value and emerging third-party solutions to the end customer. Using the Cadence and Flomerics technologies together enables the companies' mutual customers to streamline the PCB design process by addressing and solving thermal issues during the architectural phase of the project, when changes are easier and less expensive to make.
"These days thermal densities are such that engineers must consider thermal solutions and the consequent mechanical requirements in the earliest stages of board design," said Dr. Mike Reynell, Director of Marketing for Flomerics. "Our new link to Allegro PCB Editor enables users to analyze and optimize a thermal model of their board in a matter of minutes."
FLO/PCB for Allegro also exchanges information with the other members of the Flomerics integrated analysis environment, Flotherm and Flo/EMC. For example, the same PCB design that is used to create a FLO/PCB model can also be incorporated into a system-level model in Flotherm. Being able to address thermal management and EMC issues within a single environment makes it possible for mechanical engineers to get a head start on the difficult design tradeoffs that are frequently required between these two disciplines.
FLO/PCB promotes a conceptual design process that integrates electrical and mechanical design for printed-circuit boards, enabling early resolution of component placement and thermal issues - a capability that is proving critical for design of high-performance electronics. FLO/PCB combines functional, component placement and thermal views of the design into a single virtual model, enabling systems, hardware, mechanical and thermal engineers to design collaboratively and re-solve design conflicts quickly and effectively.
The Cadence Connections program promotes interoperability in all areas of electronic design, bringing value and third-party solutions to our customers' design chain. Connections Program members develop integrated software solutions that extend and add value to Cadence's leading design and verification technology. Information about the Connections program may be found at http://www.cadence.com/partners/connections/ .
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